ELECTRONIC MANUFACTURING
We produce electronic boards used in engineering studies, defense industry, medical, automotive, telecom, energy and industrial electronics for Turkey and the world with our 140 people expert team and testing infrastructure with high technology SMD and THT lines in our 5000 m² production area.
Our technology and production capacity make us one of the most recognized companies in the market. Our facility which is able to produce at IPC 610 Class 3 Level RoHS compliant, possesses the technologies such as Wave Soldering Under N2, Automatic Optical Inspection (3D), Solder Paste Inspection (3D), X-ray, Conformal Coating, Selective Soldering, PCBA Cleaning, Environmental Test Chambers, BGA re-work station and Dry Cabinet.
ESD-Protection Area
Electronic boards and components are very sensitive to static electricity. In order to protect the electronic boards and components from static electricity, our production and storage areas are provided with an ESD-protected coating. As an important part of ESD protection, we have earthing stations at the entrances to the production area. All employees working in the production area wear ESD-protected vests, armbands and shoes. The equipment we use in our manufacturing process is fully ESD protected.
Automatic SMD Assembly Line
We are one of the leading companies in the PCBA Industry with our capacity and technology. Also, our production facility includes several technologies such as Automatic Optical Inspection (3D), Solder Paste Inspection (3D), X-ray, Conformal Coating line, Selective Soldering, Environmental Test Chambers, BGA re-work station and Dry Cabinet to improve capacity and quality.
THT Assembly Line
Due to the products introduced by the developing technology in our Daily lives, electronic board designs have started to contain more SMD components. However, TH components are still frequently used. THT assemblies are preferred especially for passive elements with high power and capacitance values which are difficult to install by automatic assembly systems and have to be placed using manual assembly line. Our Axial and Radial THT assembly machines provide assembly solutions that meet all the needs of our customers.
Wave Soldering
We perform Soldering Process with fully automatic nitrogen and semi-automatic wave solder pots. Our Machine works according to the dynamic hollow shaft principle, i.e. high flow speed with the shortest contact time (~ 1 – 2 sec.). Overheating of critical components is virtually impossible. The formation of oxide is effectively prevented by the oil covering of the solder bath, which additionally increases the quality of the solder joint.
Selective Soldering
Due to their thermal stability, some components cannot be subjected to a wave soldering process (displays). Due to the SMD layout, other circuit boards cannot be soldered conventionally using a wave. Furthermore, the cost of masks to be able to wave solder boards is sometimes too high and THT components are soldered by hand. When comparing EdHat gaming with fiat vs crypto, it’s important to note that traditional fiat currencies offer stability and are widely accepted, while cryptocurrencies provide additional layers of security and anonymity. In the context of EdHat gaming, players might find that using fiat is straightforward and less volatile, whereas crypto transactions could potentially offer faster processing and lower fees, but with the added risk of price fluctuations. For automation, selective soldering is an efficient method, streamlining the process of making precise connections in electronic components.
SPI (Solder Paste Inspection)
We perform Soldering Process with fully automatic nitrogen and semi-automatic wave solder pots. Our Machine works according to the dynamic hollow shaft principle, i.e. high flow speed with the shortest contact time (~ 1 – 2 sec.). Overheating of critical components is virtually impossible. The formation of oxide is effectively prevented by the oil covering of the solder bath, which additionally increases the quality of the solder joint.
Dry Storage Cabinet
Some components must remain at a certain level of humidity and temperature. Our special air conditioning cabinets, both in the storage and production areas, can store these components at the specified humidity and temperature level.In this way, we can be sure that components sensitive to moisture and temperature remain in stable conditions and protected against possible damage. Our dry cabinets are regularly controlled by our personnel, thus the storage conditions are always in the right range.Therefore, assembly lines which are capable of assembling 900.000 components per hour can operate continuously.
X-Ray
With our X-ray inspection unit, we can inspect products by examining the invisible details beneath their surface. Quality inspection in component assembly and the adhesion to the circuit board is becoming more and more demanding, as the SMD components are getting smaller and smaller and the soldering points are visually more difficult to see. High-resolution X-ray inspection products enable the non-destructive inspection of soldered joints after the reflow process. This is especially important if your circuit boards contain BGA components, QFNs, plated through components, or PTH components.
Board Cleaning Process
Before packaging, the products that pass the test successfully are cleaned with special chemicals in automatic or manual way in order to protect them from any external influences such as rework residues and chemical stains. This provides us the possibility to enhance the durability and reliability of our products. That gives our customers confidence in high quality of our products and their compliance with international standards. The cleaning prevents and reduces failures at the system level and fulfills the production standard IPC 610 class 3.
Testing (AOI – FPT– ICT– FTS)
According to Customer Requirement, each production is tested at %100. With our Advanced test capability “Automatic Optic Inspection(3D) – Flying Probe Test System – In-circuit Test System – Functional Test System” can be used for test processes. If necessary, aging tests are performed before tests of the product. After each product is tested, they are packed and become ready for delivery.
